TE Connectivity™ has introduced a new, improved version of its Z-PACK™ HM-Zd connector for high data-rate communications equipment, offering users a connector with less susceptibility to interference.
The Z-PACK HM-Zd Plus connector features added ground contacts on the outside pair of the receptacle connector. This reduces interference attributable to cross-talk compared to the previous generation of the product.
The Z-PACK HM-Zd Plus connector supports data transfers at rates up to 15Gbits/s. TE Connectivity’s product development plan will see this specification rise to 20Gbits/s in future.
The daughter card connector remains compatible with the existing Z-PACK HM-Zd backplane connector.
Users of telecoms and networking equipment can upgrade installed devices in the field by plugging the Z-PACK HM-Zd Plus receptacles into existing Z-PACK HM-Zd backplane connectors.
The Z-PACK HM-Zd Plus has integrated prealignment features and polarisation built into the mating interface, providing for robust and reliable mating.
- Storage devices
- Test and measurement equipment
- Medical diagnostic equipment
- ATCA equipment
- Meets requirements of ATCA zone 2 standard
- Standard module size of 25mm
- 20.32mm card pitch for two-pair headers
- 25.40mm card pitch for four-pair headers