TE Connectivity’s Z-PACK™ Slim UHD range of backplane connectors is a flexible and upgradeable system designed to fit applications with a slot pitch of 15mm (0.6 inch) or more.
Z-PACK Slim UHD connectors have an extremely high contact density combined with excellent high-speed signal performance. This means that manufacturers can use them in the densest backplane designs. The Z-PACK Slim UHD connector is around 10% smaller than equivalent products on the market today, making it well suited to applications in which PCB space is at a premium.
The connectors transfer data at a rate of 12.5Gbits/s, with scalability up to 20Gbits/s. This means that, as system designs are upgraded to meet the requirement for higher speeds, the existing PCB footprint does not need to be changed.
The product also offers flexible configurations, enabling the user to devise a pin assignment suited to their application. It allows for easy assembly thanks to its press-fit termination technology and a micro-floatable contact design.
- Telecommunication equipment
- Factory-automation equipment
- 55 signal lines/cm²
- Low profile of 7.85mm
- Integrated alignment correction